The prototype card on display at CES supports up to 384GB of combined LPDDR5X and DDR5 memory, including as much as 128GB of soldered VRAM. It ...
Abstract: The concept of Compressed Sensing-aided Space-Frequency Index Modulation (CS-SFIM) is conceived for the Large-Scale Multi-User Multiple-Input Multiple-Output Uplink (LS-MU-MIMO-UL) of ...
As promised, Intel has launched the Core Ultra Series 3 processors at CES 2026. These are the long-awaited "Panther Lake" chips, and if Intel's claims hold up under our own testing, they look ...
Data Center Building Block Solutions (DCBBS) and Advanced Direct Liquid Cooling (DLC) Technology with Supermicro US Based ...
At CES 2026, the big maker of mobile chips teased details—and some benchmarks—for its new mainstream Snapdragon processor ...
Crowds formed around the company's booth at the event, where engineers from Google, Meta, and Amazon came to see RNGD's live demo. For Paik, it was ...
Abstract: Graph learning-based multi-modal integration and classification is one of the most challenging tasks for disease prediction. To effectively offset the negative impact among modalities in the ...
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